Method of and apparatus for cleaning workpiece
US5860181A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 20, 1996 |
| Grant date | Jan 19, 1999 |
| Priority date | — |
| Expiry date | Sep 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of and an apparatus for cleaning workpiece is suitable for cleaning a substrate such as a semiconductor substrate, a glass substrate, or a liquid crystal panel to a high level of cleanliness. The method of cleaning a workpiece comprises the steps of holding a workpiece, scrubbing the workpiece with a cleaning member, and rubbing the cleaning member against a member having a rough surface to carry out a self-cleaning of the cleaning member. The cleaning member which is contaminated by having scrubbed the workpiece is rubbed against the rough surface, and the rough surface scrapes the contaminant off the cleaning member. Therefore, the contaminant can effectively be removed from the cleaning member, and hence the cleaning member has a high self-cleaning effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.