Method and apparatus for cleaning edges of contaminated substrates
US5861066A · kind A · utility
39Cited by
8References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 1, 1996 |
| Grant date | Jan 19, 1999 |
| Priority date | — |
| Expiry date | May 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.