Substrate cleaning method and a substrate cleaning apparatus
US5862823A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 1996 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Oct 10, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The substrate cleaning method for performing cleaning processing on a plurality of substrates disposed such that front surfaces of the substrates on which a circuit pattern is to be formed extend substantially in a vertical direction. This method includes a step of picking up substrates contained in a cassette, all together, from the cassette, a step of making front surfaces of adjacent substrates face each other without bringing the front surfaces into contact with each other, while making back surfaces of adjacent substrates face each other without bringing the back surfaces into contact with each other, the front surfaces of the adjacent substrates being situated with a pitch interval L.sub.1 interposed therebetween, and the pitch interval being set to be larger than a pitch interval L.sub.2 interposed between the back surfaces of the adjacent substrates, a step of dipping the plurality of substrates thus disposed, all together, into a chemical solution, and a step of making the chemical solution flow between the front surfaces of adjacent substrates of the plurality of substrates, facing each other, and between the back surfaces of adjacent substrates of the plurality of substr…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.