Semiconductor inner lead bonding tool
US5868301A · kind A · utility
26Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1996 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Apr 10, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead bonding tool for bonding leads to respective semiconductor chip contacts. The bonding tool having a substantially flat bonding surface region with a depression therein. The depression allows the tool to grasp the lead during the bonding step and further facilitate the transmission of energy from the tool to the lead/contact interface to form the bond. Certain embodiments of the lead also have grooves and/or guides which are adapted to capture and better align the elongated lead sections with their respective chip contacts during the bonding step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.