Inventor · Redwood City, CA, US

Flynn Carson

45Patents
14h-index
58Co-inventors
84Inventor score

Filing activity: Apr 10, 1996 → Dec 8, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US7429786B2 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides Electricity 142 Active
US7053477B2 Semiconductor multi-package module having inverted bump chip carrier second package Electricity 91 Expired
US6967126B2 Method for manufacturing plastic ball grid array with integral heatsink Electricity 67 Expired
US7354800B2 Method of fabricating a stacked integrated circuit package system Electricity 64 Active
US6661083B2 Plastic semiconductor package Electricity 52 Expired
US7253511B2 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package Electricity 40 Expired
US7247519B2 Method for making a semiconductor multi-package module having inverted bump chip carrier second package Electricity 28 Expired
US8110441B2 Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die Electricity 26 Active
US5868301A Semiconductor inner lead bonding tool Electricity 26 Expired
US8067268B2 Stacked integrated circuit package system and method for manufacturing thereof Electricity 23 Active
US9721903B2 Vertical interconnects for self shielded system in package (SiP) modules Electricity 23 Active
US7750454B2 Stacked integrated circuit package system Electricity 20 Active
US9589936B2 3D integration of fanout wafer level packages Electricity 18 Active
US9679801B2 Dual molded stack TSV package Electricity 15 Active
US8598690B2 Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground Electricity 13 Active
US7494847B2 Method for making a semiconductor multi-package module having inverted wire bond carrier second package Electricity 11 Active
US7692279B2 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package Electricity 11 Active
US8409920B2 Integrated circuit package system for package stacking and method of manufacture therefor Electricity 10 Active
US6614123B2 Plastic ball grid array package with integral heatsink Electricity 9 Expired
US7687315B2 Stacked integrated circuit package system and method of manufacture therefor Electricity 8 Active
US6468830B1 Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor Electricity 8 Expired
US8723302B2 Integrated circuit package system with input/output expansion Electricity 8 Active
US9484279B2 Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die Electricity 6 Active
US9236319B2 Stacked integrated circuit package system Electricity 4 Active
US6791169B2 Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor Electricity 4 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.