Semiconductor device with lead structure on principal surface of chip
US5869888A · kind A · utility
4Cited by
3References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 26, 1996 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Sep 26, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.