Mounting arrangement for securing an intergrated circuit package to heat sink
US5869897A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1997 |
| Grant date | Feb 9, 1999 |
| Priority date | — |
| Expiry date | Oct 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a ribbon-like shape having opposing ends that extend from a curvelinear bottom surface. The bottom surface of the retaining-spring is provided with an opening configured to mate with the centered protrusion on the package cover, such that the opposing ends of the retaining-spring extend away from the package cover at substantially the same, albeit reverse angles. In order to mount the IC package to a heat sink, the bottom surface of the retaining-spring may be compressively mated onto the package cover at the same time the package is inserted between two substantially parallel walls protruding from the heat sink surface, wherein the walls are distanced from each other. just so as to cause moderate compression of the opposing ends of the spring toward each other as the package is inserted against the heat sink surface. The opposing surfaces of the two walls are provided with a plurality of notches formed substantially parallel to the hea…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.