Patent · US Expired

Magnet design for a sputtering chamber

US5876574A · kind A · utility

12Cited by

10References

3Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Ralf Hofmann · Heidenheim, DE
Zheng Xu · Hangzhou City, CN

Key dates

Filing date	Apr 23, 1997
Grant date	Mar 2, 1999
Priority date	—
Expiry date	Apr 23, 2017

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3452
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

In order to improve the uniformity of erosion of a sputtering chamber target during sputtering, and to prevent re-deposition of target material onto the target surface, the size and shape of the magnet pair above the target is chosen to maximize uniform erosion across the surface of the target. Re-deposition of target material onto the target is particularly a problem during plasma, high pressure sputtering.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.