Patent · US Expired

Lateral gate, vertical drift region transistor

US5877047A · kind A · utility

10Cited by
7References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 15, 1997
Grant dateMar 2, 1999
Priority date
Expiry dateAug 15, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/931

Abstract

This is a method of fabricating a lateral gate, vertical drift region transistor including a semiconductor substrate having a drain on the reverse surface. A doped semiconductor layer is formed on the substrate and a high resistivity region is formed adjacent the surface of the doped layer so as to define a vertical drift region in the doped layer. A lateral channel is formed on the high resistivity region and the doped layer so as to communicate with the vertical drift region. A source is positioned on the lateral channel spaced laterally from the vertical drift region and a gate is positioned on the lateral channel between the drift region and the source.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.