Spin cleaning method
US5882433A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 21, 1996 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | May 21, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
At first, a semiconductor wafer is held and rotated by a spin chuck, and supplied with a hydrofluoric acid solution from a chemical liquid nozzle to remove natural oxide films on the wafer. Then, the wafer is supplied with pure water for rinsing it from a rinsing nozzle while the wafer is rotated. Right before the pure water stops being supplied, the wafer is supplied with an IPA liquid from a replacing medium nozzle while the wafer is rotated. The pure water is replaced with the IPA liquid by means of the Marangoni effect and a centrifugal force. Then, the wafer is rotated at 300 rpm for one second, at 3000 rpm for four seconds, and at 5000 rpm for five seconds, in this order, to remove the IPA liquid by means of a centrifugal force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.