Method and apparatus for both mechanically and electrostatically clamping a wafer to a pedestal within a semiconductor wafer processing system
US5885428A · kind A · utility
35Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 4, 1996 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Dec 4, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for retaining a workpiece in a process chamber of a semiconductor wafer processing system. The apparatus has a mechanical clamp for clamping the periphery of the workpiece to a pedestal and an electrostatic clamp for clamping the center of the workpiece to the pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.