Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing
US5886866A · kind A · utility
66Cited by
15References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 6, 1998 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Jul 6, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck including a body of ceramic material, a pair of electrodes embedded in the body of ceramic material, and two feedthroughs connected to each of the electrodes for receiving DC chucking voltage, RF biasing power, and electric heating current. The electrode structure simultaneously provides biasing, chucking and heating of a wafer that is retained by the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.