Patent · US Expired

Photoresist film for deep ultra violet and method for forming photoresist film pattern using the same

US5888698A · kind A · utility

5Cited by
2References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 28, 1997
Grant dateMar 30, 1999
Priority date
Expiry dateMay 28, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S430/111
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A photoresist film superior in etch resistance and PED stability, as well as transmittance to deep UV, having a backbone of polymethylmethacrylate grafted with piperidine moiety of which the nitrogen atom acts as a base.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.