Three-dimensional device layout with sub-groundrule features

US5893735A · kind A · utility

Assignees

• Siemens Aktiengesellschaft · DE
• International Business Machines Corporation · US

Inventors

• Reinhard Stengl · Stadtbergen, DE
• Erwin Hammerl · Stormville, US
• Jack A. Mandelman · Stormville, US
• Herbert L. Ho · New Windsor, US
• Radhika Srinivasan · Mahwah, US
• Alvin P. Short · Chester, US
• Bernhard Poschenrieder · Saint-Cloud, FR

Key dates

• Filing date: Nov 1, 1996
• Grant date: Apr 13, 1999
• Expiry date: Nov 1, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10B12/373

Abstract

Method for forming three-dimensional device structures comprising a second device having sub-groundrule features formed over a first device is disclosed. A layer having a single crystalline top surface is formed above the first device to provide the base for forming the active area of the second device. the sub-groundrule feature is formed using mandrel and spacers.