Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
US5893754A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 1996 |
| Grant date | Apr 13, 1999 |
| Priority date | — |
| Expiry date | May 21, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a method for chemical-mechanical planariztion of semiconductor wafers that is highly useful for planarazing stop-on-feature design wafers. Initially, the wafer is positioned against a liquid solution over a planarizing surface of a polishing pad. At least one of the wafer or the pad is moved with respect to the other at a relatively low velocity to maintain a substantially continuous film of liquid solution between the wafer and the pad. The temperature of a pad platen is also controlled to maintain a relatively low temperature of the liquid solution at which the solution is highly selective to a layer of material on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.