Microelectronic package including a polymer encapsulated die, and method for forming same

US5895229A · kind A · utility

Assignee

• Motorola, Inc. · US

Inventors

• Francis J. Carney · Mesa, US
• George Amos Carson · Elk Grove Village, US
• Phillip Celaya · Gilbert, US
• Harry Fuerhaupter · Lombard, US
• Frank Tim Jones · Gilbert, US
• Donald H. Klosterman · معلمی نژاد, US
• Cynthia M. Melton · Bolingbrook, US
• James H. Knapp · Chandler, US
• Keith E. Nelson · Tempe, US

Key dates

• Filing date: May 19, 1997
• Grant date: Apr 20, 1999
• Expiry date: May 19, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24). The polymeric precursor (36) is the…