Inventor · Gilbert, AZ, US

Phillip Celaya

29Patents
9h-index
37Co-inventors
75Inventor score

Filing activity: Apr 23, 1991 → Jun 17, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US5808873A Electronic component assembly having an encapsulation material and method of forming the same Electricity 108 Expired
US6093972A Microelectronic package including a polymer encapsulated die Electricity 93 Expired
US5895229A Microelectronic package including a polymer encapsulated die, and method for forming same Electricity 91 Expired
USD510728S1 Semiconductor device package General 34 Expired
USD504874S1 Semiconductor device package General 32 Expired
US6889429B2 Method of making a lead-free integrated circuit package Emerging Cross-Sectional Technologies 24 Expired
US5085839A Apparatus for the prevention of acid gas excursions Emerging Cross-Sectional Technologies 18 Expired
US8071427B2 Method for manufacturing a semiconductor component and structure therefor Electricity 15 Active
US7298034B2 Multi-chip semiconductor connector assemblies Electricity 10 Expired
US7495323B2 Semiconductor package structure having multiple heat dissipation paths and method of manufacture Electricity 7 Active
US7202105B2 Multi-chip semiconductor connector assembly method Electricity 5 Expired
US8581416B2 Method of forming a semiconductor device and leadframe therefor Electricity 3 Active
US9899349B2 Semiconductor packages and related methods Electricity 3 Active
US10304798B2 Semiconductor packages with leadframes and related methods Electricity 3 Active
US7202106B2 Multi-chip semiconductor connector and method Electricity 2 Expired
US8461670B2 Semiconductor component and method of manufacture Electricity 2 Active
US7508060B2 Multi-chip semiconductor connector assemblies Electricity 1 Active
US8324026B2 Method for manufacturing a semiconductor component Electricity 1 Active
US9379048B2 Dual-flag stacked die package Electricity 1 Active
US7180170B2 Lead-free integrated circuit package structure Emerging Cross-Sectional Technologies 1 Expired
US7638863B2 Semiconductor package and method therefor Emerging Cross-Sectional Technologies 1 Active
US7875964B2 Multi-chip semiconductor connector and method Electricity 1 Active
US7825505B2 Semiconductor package and method therefor Emerging Cross-Sectional Technologies 0 Active
US9620443B2 Semiconductor component and method of manufacture Electricity 0 Active
US11557530B2 Semiconductor devices and methods of making the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.