Vertical polishing tool and method
US5897425A · kind A · utility
6Cited by
14References
67Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1997 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | Apr 30, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vertically-oriented wafer polishing apparatus and method is disclosed including a vertically-oriented polishing device, a semiconductor wafer carrier and a cleaning module to clean the polishing device by removing contaminants that may scratch the wafer and also reduce the polishing rate of the apparatus. The device reduces the "down time" of a polishing apparatus and, therefore, increases the yield of well-polished wafers in a given time period.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.