Chemical mechanical polishing with multiple polishing pads
US5897426A · kind A · utility
119Cited by
5References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 24, 1998 |
| Grant date | Apr 27, 1999 |
| Priority date | — |
| Expiry date | Apr 24, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.