Bump levelling method and bump levelling apparatus
US5899140A · kind A · utility
5Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1997 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Dec 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.