Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
US5900582A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1998 |
| Grant date | May 4, 1999 |
| Priority date | — |
| Expiry date | Mar 31, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer frame section, a die pad displaced from the outer frame section, and a suspending lead connecting the die pad to the outer frame section with the die pad disposed inside the outer frame section; and a frame for leads including an outer frame portion and leads extending from opposite sides of the outer frame portion, connected to the frame for a die pad, the die pad being connected to the frame for leads at the suspending lead, wherein one of the frame for a die pad and the frame for leads includes a projection and the other of the frame for a die pad and the frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to the frame for leads, connecting the frame for a die pad to the frame for leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.