Apparatus and method for enhancing uniformity of a metal film formed on a substrate with the aid of an inductively coupled plasma
US5902461A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1997 |
| Grant date | May 11, 1999 |
| Priority date | — |
| Expiry date | Sep 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3266
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for sputtering ionized material onto a substrate with the aid of an inductively coupled plasma which ionizes the material, which apparatus includes: a support member having a support surface for supporting a substrate; a target constituting a source of sputtering material; a coil for generating a plasma which is inductively coupled to the coil and which ionizes material sputtered from the target; and components for piacing the support member at a potential which causes ionized material to be attracted to the support member. Magnets are provided to generate a magnetic field which is defined by magnetic field lines that lie in planes substantially perpendicular to the support surface and which have a constant polarity around the support surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.