Heating device, method of manufacturing the same, and processing apparatus using the same
US5904872A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 27, 1995 |
| Grant date | May 18, 1999 |
| Priority date | — |
| Expiry date | Sep 27, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heating device is formed by a heating plate formed of silica and having a heating surface for heating an object to be heated, a heating element having a predetermined pattern and fixed to a surface opposing the heating surface of the heating plate, and a reflecting plate formed of silica and brought into tight contact with the surface of the heating plate on which the heating element is formed. This heating device is arranged in a processing vessel in a CVD apparatus, and a semiconductor wafer is placed on the heating device. A process gas is supplied into the processing vessel while the semiconductor wafer is heated, thereby forming a predetermined film on the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.