Semiconductor processing furnace outflow cooling system
US5908292A · kind A · utility
25Cited by
9References
43Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1997 |
| Grant date | Jun 1, 1999 |
| Priority date | — |
| Expiry date | Mar 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vertically oriented thermal processor for processing batches of semiconductor wafers held within a processing chamber. The processing chamber is contained within a processing vessel. Processing gases are discharged through a processing chamber outflow. An outflow cooler is included to cool gases exhausting from the processing chamber outflow. The outflow cooler includes a fluid heat exchanger and a flow diverter which directs the exhausting gases against cooled walls of the outflow cooler. The cooler also preferably has a liner which lines a casing to which the heat exchanger is connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.