Method and apparatus for in-line solder paste inspection
US5912984A · kind A · utility
79Cited by
14References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1996 |
| Grant date | Jun 15, 1999 |
| Priority date | — |
| Expiry date | Dec 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Inspection of solder paste on a printed circuit board using a before printing image (pre-image) to normalize an after printing image (post-image) of the printed circuit board. Existing lighting and optics used for alignment of the screen printing stencil to the printed circuit board are used for the solder paste inspection. A stencil in the screen printing process is also inspected using a before printing image (pre) to normalize an after printing image (post) of the stencil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.