Method for fabricating copper-aluminum metallization
US5913147A · kind A · utility
385Cited by
4References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 21, 1997 |
| Grant date | Jun 15, 1999 |
| Priority date | — |
| Expiry date | Jan 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating copper-aluminum metallization utilizing the technique of electroless copper deposition is described. The method provides a self-encapsulated copper-aluminum metallization structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.