Method for forming an interconnect for testing unpackaged semiconductor dice
US5915755A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1997 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Oct 17, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for forming an interconnect for establishing electrical communication with a semiconductor die is provided. The method includes: providing a microbump tape and then mounting the tape to a substrate with a compliant layer therebetween. The microbump tape includes an insulating film having a pattern of microbump contact members corresponding to a pattern of bond pads on the die. The compliant layer can be formed of a curable adhesive such as a silicone elastomer. A coupon containing a plurality of microbump tapes can be mounted to a substrate wafer which can then be singulated to form a plurality of interconnects. The interconnects can be used with a testing apparatus for testing unpackaged semiconductor dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.