Methods and apparatus for polishing wafers
US5916016A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1997 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Oct 23, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a chemical mechanical polishing system. The system includes a mechanical arm and a carrier body that is configured to be coupled to the mechanical arm. The carrier body has a recessed portion for retaining a semiconductor wafer. The recessed portion has a carrier film that is in direct contact with a back side of the semiconductor wafer. The system further includes a plurality of pressure rings that are defined in the carrier body, such that the plurality of pressure rings are in direct contact with the carrier film. Each of the plurality of pressure rings are used to apply a selected pressure to the carrier film, such that the carrier film produces a back pressure against the back side of the semiconductor wafer. The back pressure is configured to be consistent with the selected pressure that is applied to each of the plurality of pressure rings. Whereby the selected pressure that is applied to each of the plurality of pressure rings controls a polishing rate in a plurality of concentric areas of the semiconductor wafer that correspond to the plurality of pressure rings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.