Inventor · Fremont, CA, US

Subhas Bothra

90Patents
24h-index
39Co-inventors
84Inventor score

Filing activity: Dec 14, 1994 → Mar 14, 2011

Most-cited inventions

PatentTitleAreaCited byStatus
US6127811A Micro-electromechanical system and voltage shifter, method of synchronizing an electronic system and a micromechanical system of a micro-electromechanical system Electricity 156 Expired
US5798559A Integrated circuit structure having an air dielectric and dielectric support pillars Emerging Cross-Sectional Technologies 85 Expired
US6143642A Programmable semiconductor structures and methods for making the same Electricity 83 Expired
US5854510A Low power programmable fuse structures Electricity 75 Expired
US5916016A Methods and apparatus for polishing wafers Performing Operations; Transporting 75 Expired
US6492716B1 Seal ring structure for IC containing integrated digital/RF/analog circuits and functions Electricity 70 Expired
US5915203A Method for producing deep submicron interconnect vias Electricity 65 Expired
US6323113A Intelligent gate-level fill methods for reducing global pattern density effects Electricity 59 Expired
US5882998A Low power programmable fuse structures and methods for making the same Electricity 59 Expired
US6020616A Automated design of on-chip capacitive structures for suppressing inductive noise Electricity 58 Expired
US5639697A Dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing Emerging Cross-Sectional Technologies 56 Expired
US5597668A Patterned filled photo mask generation for integrated circuit manufacturing Physics 56 Expired
US6275971A Methods and apparatus for design rule checking Physics 49 Expired
US6214734A Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection Emerging Cross-Sectional Technologies 47 Expired
US6057224A Methods for making semiconductor devices having air dielectric interconnect structures Emerging Cross-Sectional Technologies 46 Expired
US6569757B1 Methods for forming co-axial interconnect lines in a CMOS process for high speed applications Emerging Cross-Sectional Technologies 45 Expired
US6281585A Air gap dielectric in self-aligned via structures Electricity 43 Expired
US6030885A Hexagonal semiconductor die, semiconductor substrates, and methods of forming a semiconductor die Electricity 41 Expired
US6545338B1 Methods for implementing co-axial interconnect lines in a CMOS process for high speed RF and microwave applications Electricity 34 Expired
US6189136A Design level optical proximity correction methods Physics 32 Expired
US5834356A Method of making high resistive structures in salicided process semiconductor devices Electricity 30 Expired
US6313466A Method for determining nitrogen concentration in a film of nitrided oxide material Electricity 29 Expired
US6387720B1 Waveguide structures integrated with standard CMOS circuitry and methods for making the same Physics 28 Expired
US5540958A Method of making microscope probe tips Physics 25 Expired
US6133635A Process for making self-aligned conductive via structures Electricity 23 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.