Apparatus for and method of polishing workpiece
US5916412A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1996 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Oct 9, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.