Technique and apparatus for testing electrostatic chucks
US5917327A · kind A · utility
7Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1997 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Sep 8, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R35/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A testing apparatus including a testing plate can be used to test an electrostatic wafer chuck. A DC potential is supplied so as to produce an electrostatic force. A mechanical force is supplied to the testing plate in order to give an indication of the produced electrostatic force. By examining the DC potential and the produced electrostatic force, an electrostatic wafer chuck can be qualified or rejected before being placed into a wafer processing machine. This reduces the possibility of damage to the wafer or the wafer processing machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.