Gap filling method using high pressure
US5918152A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1997 |
| Grant date | Jun 29, 1999 |
| Priority date | — |
| Expiry date | Sep 19, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is described for filling narrow gaps in a surface that is being overcoated. This has been achieved by heating the overcoating layer to a sufficient extent so that it flows relatively easily. This, in combination with externally applied pressure, causes the overcoating layer to effectively fill any narrow gaps in the surface being coated. Temperature and pressure are applied for a time that is sufficient to allow small quantities of gas that may have become trapped in the gaps to bubble to the surface. In an alternative embodiment, the surface to be coated is subjected to negative pressure prior to application of the coating. This eliminates the possibility of trapping gas in the gaps so a waiting time is no longer necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.