Fixed abrasive polishing pad
US5919082A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1997 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Aug 22, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/205
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished. Preferably, a portion of the second member can be removed from the polishing pad so that the first polishing surface extends beyond the second polishing surface to provide for a fixed amount of abrasion using the first member prior to the second member contacting the surface and substantially reducing or stopping the polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.