Semiconductor device and method of forming the device
US5920117A · kind A · utility
77Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1997 |
| Grant date | Jul 6, 1999 |
| Priority date | — |
| Expiry date | Mar 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.