Method and apparatus for processing resist
US5923915A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1997 |
| Grant date | Jul 13, 1999 |
| Priority date | — |
| Expiry date | Oct 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resist processing method in which a substrate is successively transferred by an arm mechanism into a plurality of process units for successively processing the substrate, comprising the steps of (a) loading a substrate having a reference region which is aligned as desired relative to the process unit and the arm mechanism in a horizontal plane, into the process unit, the substrate being held substantially horizontal by a spin chuck surrounded by a drain cup, (b) rotating the spin chuck holding the substrate and supplying a process solution onto the substrate rotated together with the spin chuck, (c) stopping the supply of the process solution and also stopping rotation of the substrate, (d) detecting a position of the reference region in the horizontal plane of the substrate held on the spin chuck, (e) rotating the substrate together with the spin chuck based on the position detected in the step (d) to permit the reference region of the substrate to be aligned with an initial position in the step (a) of loading the substrate into the process unit, and (f) unloading the substrate out of the process unit when the substrate is rotated to a position at which the reference region of t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.