Electroless plating of a metal layer on an activated substrate
US5925415A · kind A · utility
31Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1998 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Mar 9, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1658
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of electroless plating at least one homogeneous metal coating in a predetermined pattern on a solid substrate surface having pendant hydroxy groups. The method includes the steps of providing a first monatomic metal layer in a predetermined pattern on the solid substrate surface having pendent hydroxy groups and then immersing the solid substrate surface in a bath containing a chemical reducing agent to build up the at least one homogeneous metal coating only on the monatomic metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.