Rita J. Klein
73Patents
7h-index
62Co-inventors
75Inventor score
Filing activity: Mar 9, 1998 → May 1, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7550380B2 | Electroless plating of metal caps for chalcogenide-based memory devices | Electricity | 90 | Active |
| US6306768A | Method for planarizing microelectronic substrates having apertures | Electricity | 73 | Expired |
| US6511576B2 | System for planarizing microelectronic substrates having apertures | Electricity | 35 | Expired |
| US6518198B1 | Electroless deposition of doped noble metals and noble metal alloys | Electricity | 34 | Expired |
| US5925415A | Electroless plating of a metal layer on an activated substrate | Chemistry; Metallurgy | 31 | Expired |
| US7109056B2 | Electro-and electroless plating of metal in the manufacture of PCRAM devices | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7935242B2 | Method of selectively removing conductive material | Electricity | 8 | Active |
| US7189626B2 | Electroless plating of metal caps for chalcogenide-based memory devices | Electricity | 7 | Expired |
| US6589414B2 | Nitride layer forming methods | Electricity | 6 | Expired |
| US6440230B1 | Nitride layer forming method | Electricity | 5 | Expired |
| US7098128B2 | Method for filling electrically different features | Electricity | 5 | Expired |
| US7303939B2 | Electro- and electroless plating of metal in the manufacture of PCRAM devices | Electricity | 4 | Expired |
| US6984301B2 | Methods of forming capacitor constructions | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6884723B2 | Methods for planarization of group VIII metal-containing surfaces using complexing agents | Chemistry; Metallurgy | 4 | Expired |
| US11393756B2 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Electricity | 3 | Active |
| US11244903B2 | Tungsten structures and methods of forming the structures | Electricity | 3 | Active |
| US6774049B2 | Electroless deposition of doped noble metals and noble metal alloys | Electricity | 3 | Expired |
| US7282387B2 | Electro- and electroless plating of metal in the manufacture of PCRAM devices | Emerging Cross-Sectional Technologies | 3 | Expired |
| US11121143B2 | Integrated assemblies having conductive posts extending through stacks of alternating materials | Electricity | 2 | Active |
| US7244678B2 | Methods for planarization of Group VIII metal-containing surfaces using complexing agents | Chemistry; Metallurgy | 2 | Expired |
| US7179361B2 | Method of forming a mass over a semiconductor substrate | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6693366B2 | Electroless deposition of doped noble metals and noble metal alloys | Electricity | 2 | Expired |
| US11342265B2 | Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systems | Electricity | 2 | Active |
| US10957775B2 | Assemblies having conductive structures with three or more different materials | Electricity | 2 | Active |
| US8728930B2 | Methods of forming metal silicide-comprising material and methods of forming metal silicide-comprising contacts | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.