Ultra fine probe contacts
US5926029A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1997 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | May 27, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0735
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This discloses a probe structure which does not rely on cantilevered wire and which has improved and controlled contact pressure between the probe tip contacts and the I/O pads on a semiconductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed on a film stretched across a respective plurality of through holes established in a substrate. The through holes and the contact electrodes are aligned with one another and both positionally match selected I/O pads existing on a semiconductor chip to be probed. Also disclosed is a probe utilizing means connected to each one of the holes to control the pressure in the holes and between the probes and any contact on a device in contact with the probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.