Vertically integrated multi-chip circuit package with heat-sink support
US5926369A · kind A · utility
125Cited by
7References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1998 |
| Grant date | Jul 20, 1999 |
| Priority date | — |
| Expiry date | Jan 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip carrier which uses less lateral mounting space on the surface of a circuit board or card can be formed using flexible circuitized material. Lateral space is compressed by utilizing more vertical space to package chips and components. The problem of cooling multiple chips in a tight space may be accomplished by integrating the heat sink in with the circuit carrier and having the heat sink double as a support structure. A flex material is folded or shaped. Different regions of the flex are used for mounting chips, mounting support mechanisms, or mounting the structure on a carrier or substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.