Method of stacking electronic components
US5926951A · kind A · utility
180Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1996 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Oct 21, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of stacking electronic components is disclosed. A first electronic component having a first interconnection substrate with a first set of contact pads on at least one surface thereof is provided. At least a first semiconductor device with resilient contact structures mounted thereto is provided. The first semiconductor device is positioned relative to the first electronic component with the resilient contact structures extending therefrom and electrically contacting the first set of contact pads of the first interconnection substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.