Flip chip bonding with non conductive adhesive

US5928458A · kind A · utility

Assignee

• Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

• Rolf Aschenbrenner · Berlin, DE
• Jorg Gwiasda · Berlin, DE
• Elke Zakel · Falkensee, DE
• Joachim Eldring · Phoenix, US

Key dates

• Filing date: Apr 10, 1997
• Grant date: Jul 27, 1999
• Expiry date: Apr 10, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/07802
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention concerns flip chip technology using non-conductive adhesives and gold ball bumps or connectors. The concept is to simultaneously attach and interconnect bare chips with gold ball bumps to organic substrates. The chip is fixed by cooling the insulative adhesive. Environmental testing has demonstrated that performance characteristics were acceptable after 1000 hours of continuous exposure to humidity, and were excellent after 1000 temperature cycles. Such stable interconnections can only be realized by the compliance of the flip chip joint. This stability, can be achieved by precise control of the bonding parameters such as temperature and pressure. This bonding technique allows quality attachment of bare chips on low cost organic substrates.