Rolf Aschenbrenner
9Patents
6h-index
10Co-inventors
52Inventor score
Filing activity: Apr 22, 1996 → Nov 1, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6651891B1 | Method for producing contactless chip cards and corresponding contactless chip card | Electricity | 41 | Expired |
| US5906312A | Solder bump for flip chip assembly and method of its fabrication | Electricity | 32 | Expired |
| US5989993A | Method for galvanic forming of bonding pads | Electricity | 16 | Expired |
| US5928458A | Flip chip bonding with non conductive adhesive | Electricity | 11 | Expired |
| US6211571A | Method and apparatus for testing chips | Electricity | 6 | Expired |
| US6277660A | Method and apparatus for testing chips | Electricity | 6 | Expired |
| US6107118A | Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way | Electricity | 3 | Expired |
| US6407457B1 | Contact-bumpless chip contacting method and an electronic circuit produced by said method | Electricity | 3 | Expired |
| US6284639A | Method for forming a structured metallization on a semiconductor wafer | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.