Wiring pattern inspecting method and system for carrying out the same
US5930382A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 1996 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | May 13, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30141
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.