Reworkable polymer chip encapsulant
US5930597A · kind A · utility
26Cited by
19References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Apr 15, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A C4 or flip chip reworkable electronic device is provided comprising an integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.