Repairing fractured wafers in semiconductor manufacturing
US5932379A · kind A · utility
10Cited by
0References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1998 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Feb 24, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/167
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The specification describes a technique for repairing wafer fractures that occur during wafer fabrication. The fractured pieces are joined edge-to-edge at the fracture line and bonded with epoxy adhesive. The method succeeds because the dimensions of the fracture line after bonding is within the reregistration tolerance of commercial step-and-repeat cameras and the reregistration capability of the camera allows normal exposure of sites that do not intersect the fracture line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.