Lead-on-chip semiconductor package and method for making the same
US5933708A · kind A · utility
7Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1997 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Apr 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a semiconductor chip to a lead frame in a LOC type semiconductor package in which a plurality of inner leads are bonded to an active surface of the semiconductor chip. A semiconductor chip is prepared with a partially-cured polyimide layer on the active surface. One or more strips of polyimide tape is attached to the inner leads. The semiconductor chip is attached to the inner leads by making an intermediate pressure bond between the polyimide tape and the partially-cured polyimide coating layer on the active surface. The polyimide coating layer is then cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.