Method for polishing thin plate and apparatus for polishing
US5934981A · kind A · utility
4Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Nov 18, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and an apparatus, for polishing a thin plate. The method comprises the steps of: rotating a holding plate on one surface of which the thin plate is held to adhere; and bringing the thin plate held on the rotating holding plate into contact with a polishing pad mounted on a surface of a rotating turn table, to polish the thin plate. The step of polishing the one surface of the holding plate is carried out by using the polishing pad for polishing the thin plate before the thin plate is held to adhere on the one surface of the holding plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.