Method for enhancing the solderability of a surface
US5935640A · kind A · utility
27Cited by
11References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Dec 2, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/073
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.