Thermally conductive chuck for vacuum processor
US5936829A · kind A · utility
35Cited by
23References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Sep 19, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A chuck body mounts a substrate within a vacuum chamber. Contiguous portions of the substrate and the chuck body form a heat-transfer interface. An intermediate sealing structure seals the chuck body to the substrate independently of any contact between the chuck body and the substrate and forms a separately pressurizable region within the vacuum chamber. A control system promotes flows of gas through a periphery of the heat-transfer interface within the separately pressurizable region for controlling gas pressures at the heat-transfer interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.