Linear conditioner apparatus for a chemical mechanical polishing system

US5938507A · kind A · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Sen-Hou Ko · Cupertino, US
• Richard V. Rafloski · San Jose, US
• James Nystrom · Palo Alto, US
• John Prince · Los Altos, US
• Alfred A. Goldspiel · Watsonville, US
• Stephen J. Blumenkranz · Los Altos Hills, US
• Manoocher Birang · Los Gatos, US

Key dates

• Filing date: Oct 27, 1995
• Grant date: Aug 17, 1999
• Expiry date: Oct 27, 2015

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B53/017
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A conditioner apparatus uses one or more linear conditioners. The linear conditioners extend from the edge of the polishing pad almost to the center of the pad. The conditioner apparatus may use two conditioner rods located on either side of a radial segment. The rods gimbal so that if one rod rises, the other rod is forced downwardly. In addition, the rods can pivot independently about a lateral axis, but they cannot pivot around the vertical axis. The linear conditioners may be actuated by a piezoelectric member or swept by an arm toward and away from the center of the polishing pad.